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MPI Corporation, a world leader in LED test solutions with an installed base of more than 10,000 24/7 operating systems, has integrated its expertise to create the Advanced Semiconductor Test (AST) division, combining manufacturing excellence with the reliability of its systems.

With one of the fastest developments on the market, it offers high-performance solutions for RF, DC or engineering Probe Stations.

MPI probe station


Standard Open Systems:


MPI TS150, TS200 & TS300 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.

They may be configured to support a wide variety of applications such as Failure AnalysisDesign Validation/IC EngineeringWafer Level ReliabilityMEMSHigh Power and Device Characterization and Modeling as well.

"MPI Manual Systems TS150"
"TS150 THZ Probe station"
Dedicated System for mmW and THz:

MPI TS150–THZ engineering probe system is a dedicated, cost effective, manual probe system designed especially for precision analysis of substrates and 150 mm wafers in sub THz range.  The system is extremely stable, with a large probe platen, and a low-profile design. Each of these essential elements are required to support a wide variety of RF and mmW applications such as broadband up to 110 GHz, banded solutions up to 1.1THz, load-pull and RF noise. 

Shielded System:

The MPI TS200-SE probe system incorporates the ShieldEnvironment™ providing optimal EMI shielding which allows ultra-low noise device on-wafer measurements for many applications such as Device Characterization and Modeling, RF & Microwave, Failure Analysis, Design Validation, and High Power up to 200mm wafer size.

The modular design concept of all MPI manual probe systems allows a unique upgrade path towards reduced cost of ownership.

"TS200 SE manual probe system"


MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development,Failure AnalysisDesign VerificationIC engineeringWafer Level Reliability as well as special requirements for MEMSHigh PowerRF and mmW device testing.

The TS2000-SE and TS3000-SE can be configured at extended temperature ranges from -60°C to +300°C and where TS2000-SE is the advanced probe system equipped with automated single wafer loader for convenient wafer swap at any temperature.

"MPI Probe Station automatization"


"Sonda RF MPI"
RF Probes:

RF wafer probes convert the electro-magnetic energy travelling along the coaxial cables to the on-wafer DUT and its contact pads. The conversion has to be carried out with minimal distortions and energy loss.

With a critical understanding of the numerous challenges associated with today’s RF applications, MPI Corporation has developed TITAN™ RF Probes, a product series specifically optimized for these complex applications centered upon the requirements of advanced RF customers. TITAN™ Probes provide the latest in technology and manufacturing advancements within the field of RF testing utilizing MPI’s world class MEMS technology. 

RF Calibration Software:

MPI’s long-time experience in wafer-level RF calibration and a detailed understanding of the microwave measurement specifics are at the bottom of QAlibria® – MPI’s RF calibration software.

QAlibria® is designed to make complex and tedious task of RF system calibration simple. Its unique features of the multi-touch and multi-language graphical user interface as well as the original NIST multi-line TRL calibration capability revolutionized the wafer-level RF system calibration.

"calibration software"